12.5 Liters Small Form Factor Design
To design a small 12.5L SFF chassis with better thermal & acoustic performance than other bigger size chassis
Compatible with all standards for desktop components. Easy system integration.
Small but flexible enough to accommodate four full height PCI cards.
Meets 65W 2006 FMB thermal target for Intel® Core™ without any case fan. Meets 30 dB(A) or 3.5 BA of system acoustic target in idle mode (Lower processor power, C1E enabled & iQST implemented for Conroe on 965/ICH8 platform).
Designed to fit standard Micro-ATX motherboards for easy system integration.
Detachable 5.25” optical drive bracket for easy installation.
Standard SFX 12V 250W & 300W power supply platform offers high performance / low power solution.
Designed for Digital Home and Digital Office. Supports 4xfull height slots for GFX / TV tuner cards.
Optional removable air filter.
Optional screwless designs-ODD/FDD/HDD bays, expansion slots and top cover clips for easy installation.
Screwless ODD Bay Clips
Screwless FDD Bays Clips
Screwless HDD Bays Clips
Screwless Expansion Slot Clip
Screwless Top Cover Clips
•Intel Mt. Jade Ref. Design •New Partition Plate Cooling Technology (New PPCT)
•No 2nd Fan (Rear Fan) Needed •Additional ventilation holes on the side panel
No Partition-top view
Partition Plate-top view
No Partition-zoom in
Partition Plate-zoom in
‧USB 2.0 x 4
‧Optional IEEE 1394
‧Optional USB 3.0 x 2
The 3rd generation of PPCT includes an adjustable air duct for various CPU fans and efficiently eliminates overheat while enhances airflow of entire system.- No second fan needed. - Supports LGA1155 Socket and downward compatible (LGA775 / LGA1156)
•Adjustable Partition Plate Cooling Tech accommodates different motherboards and provides the optimal thermal performance.
‧Removable Air Duct
* New PPCT Technology supports LGA1155 Socket and downward compatible(LGA775).
-This Partition Plate Cooling Technology is the world’s most advanced thermal & acoustic technology, which provides SFF chassis with excellent thermal solutions while creating a quieter computing experience.
- The innovative partition plate cooling technology (PPCT) is the world’s first complete thermal solution co-designed by IN WIN and Intel.
- By separating the CPU fan from the heatsink to reduce back draft, PPCT efficiently streamlines the airflow in a unilateral direction to provide exceptional thermal performance.
BK Series uses Intel Mt. Jade Ref. Design
This product is recommended to use with Intel boxed CPU cooler.
System Acoustic <30 dB(A) and 3.5 BA Lower Power – 50% lower TDP
All sound power data listed is “Measured LwA” data according to ISO 7779 standard at room temperature of 23°C ±2°C
Maxpower 85%: 4.2 BA
Idle: 3.5 BA
Maxpower 85%: 35 dB (A)
Idle: 30 dB (A)
|Cooler Fan Speed 2684 RPM||Gfxcard with Active Fansink|
|CPU||Core™ 2 Duo E6700 (2.66GHz)|
|Tcase of CPU||57.22|
|Tcase projected to 65W TDP||58.61|
|Margin to 60.1C Spec||1.49|
*Source from Mt. Jade Ref. Design, co-work by In Win and Intel. All examine source are subject to change in anytime, without notice.
*Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of IN WIN products as measured by those tests.
Any difference in system hardware or software design or configuration may affect actual performance.
Heatsink Solution for BK623(Mt Jade) chassis
Q. How to select a proper heatsink for Mt. Jade / BK Series ?
A. (1)Use Intel boxed heatsink or
(2)Select a Radial-fin heatsink (similar to the boxed fan heatsink solution from Intel).
Here is a list of 3rd Party thermal solutions per processor from Intel’s website
•IR •Removable Air Filter
•Chassis Intrusion Switch •Screwless ODD/FDD/HDD Bays Clips
•Screwless Top Cover Clips
•Key Lock Side Panel
The side panel is a theft deterrent key lock set for safeguarding your chassis equipment from unauthorized access.
3.5" to 2.5" HDD/SSD Bracket
Supports 2.5" x 2
Optional 60 mm Fan x 1
(60 x 60 x 10 mm, 2500rpm, 20dB Fan, 4 Pin Power Connector)